Ukuhlaziywa kwephutha elivamileko nokuthuthukiswa kwesakhiwo se-Dual plate wafer check valve

1. Ekusetjenzisweni kwezobunjiniyela, umonakaloIvalvu yokuhlola i-wafer yamapuleti amabilis ibangelwa ziinzathu ezinengi.

(1) Ngaphasi kwamandla wokuthinteka we-medium, indawo yokuthintana hlangana nengcenye yokuhlanganisa nenduku yokubeka incani khulu, okurholela ekutheni kube nokugandeleleka kwendawo ngayinye, begodui-Dual plate wafer check valve ilimele ngebanga lokugandeleleka okukhulu.

(2) Emsebenzini wamambala, nangabe umfutho wehlelo lepayipi awuzinzile, ukuhlobana hlangana nediski ye-i-Dual plate wafer check valve begodu induku yokubeka izokuthuthumela phambili nangemuva ngaphakathi kwe-engeli ethileko yokujikeleza induku yokubeka, okuzokwenza bona kube nediski nenduku yokubeka. Ukutjhayisana kwenzeka hlangana nazo, okwenza bona kube nokulimala kwengcenye yokuxhumana.

2. Ihlelo lokuthuthukisa

Ngokuya ngefomu lokubhalelwa iIvalvu yokuhlola i-wafer yamapuleti amabili, isakhiwo sediski yevalvu kanye nengcenye yokuhlanganisa hlangana nediski yevalvu nenduku yokubeka ingathuthukiswa ukuqeda ukugxila kokugandeleleka engcenyeni yokuhlanganisa, ukwehlisa amathuba wokuhluleka kwei-Dual plate wafer check valveekusetjenzisweni, begodu ukhulise isikhathi sokuhlola. ipilo yesevisi yevalvu. Idiski yeiIvalvu yokuhlola i-wafer yamapuleti amabili begodu ukuhlobana hlangana kwediski nenduku yokuma kwenziwa ngcono begodu kwaklanywa, begodu isofthiwe ye-finite element isetjenziselwa ukulingisa nokuhlaziya, begodu isikimu esithuthukisiweko sokurarulula umraro wokugandeleleka kokugandeleleka siyaphakanyiswa.

(1) Thuthukisa ubujamo bediski, yenza ama-groove ku-discivalvu yokuhlola ukwehlisa ikhwalithi yediski, ngaleyo ndlela kutjhugululwe ukusabalala kwamandla wediski, begodu uqale amandla wediski nokuthintana hlangana nediski nenduku yokuma. ubujamo bamandla. Isisombululo lesi singenza amandla wediski yevalvu abe yinto efanako, begodu sithuthukise kuhle ukugxila kokugandeleleka kwe-Ivalvu yokuhlola i-wafer yamapuleti amabili.

(2) Thuthukisa ubujamo bediski, begodu wenze umklamo wokuqina omise okwe-arc ngemva kwediski yevalvu yokuhlola ukwenza ngcono amandla wediski, ngaleyo ndlela utjhugulule ukusabalala kwamandla wediski, okwenza amandla wediski afane, begodu wenze ngcono ukugandeleleka kokuhlola okufanako kwevalvu.

(3) Thuthukisa ubujamo bengcenye yokuhlanganisa hlangana nediski yevalvu nenduku yokubeka, yenza ibe yinde begodu yenze ingcenye yokuhlanganisa ibe mkhulu, begodu ukhuphule indawo yokuthintana hlangana nengcenye yokuhlanganisa nemuva kwediski yevalvu, ngaleyindlela uthuthukise ukugxila kokugandeleleka kwevalvu yokuhlola i-Dual plate wafer.